Technical Data Sheet: Particle Board (Chipboard)​​ ​Composition:​​ Engineered from wood chips/lignocellulosic material, bonded with resin under heat and pressure. ​Key Properties:​​ ​Mechanical:​​ Cross-directional particle structure offers superior Modulus of Rupture (MOR ≥18MPa) and deformation resistance vs. MDF. ​Environmental:​​ >60% post-industrial wood content. Formaldehyde emissions comply with E0 (≤0.05mg/m³), ENF (≤0.025mg/m³), and F4-Star (≤0.3mg/L) standards. ​Physical:​​ Sound Absorption: 30% improvement in noise reduction. Surface Smoothness: Ra ≤5μm, ideal for direct lamination (e.g., melamine). Moisture Resistance: Short-term exposure tolerance up to 95% RH. ​Applications:​​ ​Furniture (60%+ use):​​ Cabinetry, wardrobes, shelving. ​Interior Fit-Out:​​ Moisture-resistant grades (surface absorption ≤160g/㎡) for wet areas (ceilings, partitions); acoustic panels. ​Commercial:​​ PVC-laminated panels for quick installation in hotels/offices.